Samsung Galaxy Z Flip7 FE
80
%
Spec
Score
Expected
Coming soon
Pros
- Armor aluminum frame body.
- Dynamic LTPO AMOLED 2X, HDR10+,120Hz.
- Exynos 2400 chipset with 8GB RAM.
- Stereo speakers, Fingerprint and NFC.
- 25W wired, 15W wireless charger.
Cons
- Exynos offers mid-range performance
- Secondary camera has limited functionality
- No 3.5mm headphone jack
- No microSD card slot
- USB Type-C 2.0 instead of USB 3.x
Specifications
General
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Brand
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Samsung
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Model
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Samsung Galaxy Z Flip7 FE
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Device
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Smartphones
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Added
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July 7, 2025
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Updated
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January 27, 2026
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Prices
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Unofficial
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8GB 128GB ₦875,000
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Launch
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Announced
The official date or month when the manufacturer publicly announced and introduced the product to the global market.
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2025, July 09
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Status
Current market availability status of the device (e.g. Available, Released, Coming Soon, or Discontinued).
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Available. Released 2025, July 25
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Network
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5G bands
5G (Fifth Generation) cellular technology offering ultra-high data speeds, ultra-low latency, and massive device connectivity across Sub-6GHz and mmWave frequencies.
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SA/NSA/Sub6 - InternationalSA/NSA/Sub6/mmWave - USA
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Speed
Maximum theoretical cellular download and upload data speeds supported by the device's modem (e.g. HSPA 42.2/5.76 Mbps, LTE-A, 5G SA/NSA).
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HSPA, LTE (CA), 5G
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Technology
Network technology refers to the type of cellular connectivity supported by the mobile device, such as GSM, HSPA, LTE (4G), or 5G Sub-6/mmWave.
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GSM / CDMA / HSPA / EVDO / LTE / 5G
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2G bands
2G (Second Generation) digital cellular network frequencies (typically GSM 850 / 900 / 1800 / 1900 MHz) used for basic voice calls, SMS, and low-speed data.
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GSM 850 / 900 / 1800 / 1900CDMA 800 / 1900
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3G bands
3G (Third Generation) cellular frequencies (such as UMTS/HSDPA/WCDMA) providing faster data transfer speeds, video calling, and improved internet browsing over 2G.
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HSDPA 850 / 900 / 1700(AWS) / 1900 / 2100HSDPA 850 / 900 / 1900 / 2100CDMA2000 1xEV-DO
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4G bands
4G LTE (Long-Term Evolution) frequency bands that provide high-speed mobile broadband internet access, HD voice calling (VoLTE), and low latency.
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LTE
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Body
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Dimensions
Physical dimensions (Height × Width × Thickness in millimeters and inches) defining the outer size and form factor of the phone or tablet.
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Unfolded: 165.1 x 71.9 x 6.9 mm Folded: 85.1 x 71.9 x 14.9 mm
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Weight
Total physical weight of the device in grams (g) and ounces (oz), including the internal battery.
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187 g (6.60 oz)
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Build
Exterior materials used in constructing the device (such as glass front, glass or ceramic back, aluminum or plastic frame, eco-leather finish).
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Plastic front (unfolded), glass back (Gorilla Glass Victus 2), aluminum frame
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SIM
Type and number of SIM card slots supported (e.g., Nano-SIM, Dual SIM with dual standby, eSIM support, hybrid slots).
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Nano-SIM + multiple eSIM (max 2 at a time)
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Others
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IP48 dust and water resistant (dust > 1mm; immersible up to 1.5m for 30 min)Armor aluminum frame
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Display
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Features
Special screen features like high refresh rate (90Hz, 120Hz, 144Hz), HDR10+, Dolby Vision, peak brightness in nits, PWM dimming, or always-on display.
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HDR
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Type
Display panel technology (such as AMOLED, Super AMOLED, OLED, IPS LCD, LTPO, or TFT) determining color vibrancy, contrast ratios, and viewing angles.
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Non-removable Li-Po
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Size
Diagonal measurement of the display screen measured in inches (″) or centimeters (cm) and screen-to-body percentage ratio.
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6.7 inches, 101.5 cm2 (~85.5% screen-to-body ratio)
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Resolution
Total number of pixels displayed horizontally and vertically (e.g., FHD+ 1080 × 2400 pixels), aspect ratio, and pixel density in pixels per inch (ppi).
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1080 x 2640 pixels (~426 ppi density)
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Platform
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OS
Operating System and custom user interface software installed on the device (such as Android 14 with HyperOS, One UI, OxygenOS, iOS, or HarmonyOS).
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Android 15, One UI 7
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Chipset
System on a Chip (SoC) combining the central processor, graphics processor, neural engine, and modem (e.g., Qualcomm Snapdragon, MediaTek Dimensity, Apple Bionic, Google Tensor).
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Exynos 2400 (4 nm)
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CPU
Central Processing Unit architecture, core count (e.g., Octa-core), and clock speeds in GHz handling all primary computing tasks.
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10-core (1x3.2GHz Cortex-X4 & 2x2.9GHz Cortex-A720 & 3x2.6GHz Cortex-A720 & 4x1.96GHz Cortex-A520)
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GPU
Graphics Processing Unit (such as Adreno, Mali, or Immortalis) responsible for 3D graphics rendering, video decoding, and smooth gaming.
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Xclipse 940
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Memory
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Card slot
Support for external memory expansion (such as microSDXC) through a dedicated memory slot or shared hybrid SIM tray.
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No
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Internal
Built-in onboard flash storage capacity (ROM) and operating memory (RAM) configurations (e.g. 128GB 8GB RAM, 256GB 12GB RAM) using UFS or eMMC flash standards.
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128/256 GB
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Variant
Storage and RAM combinations available for this specific product model.
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8GB 128GB / 8GB 256GB
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Main camera
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Dual
Dual camera sensor setup (typically primary wide-angle lens paired with ultra-wide, telephoto, depth, or macro sensor).
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50 MP, f/1.8, 23mm (wide), 1/1.57", 1.0µm, dual pixel PDAF, OIS12 MP, f/2.2, 13mm, 123˚ (ultrawide), 1/3.2", 1.12µm
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Video
Maximum video recording resolutions and frame rates supported (such as 8K@24/30fps, 4K@30/60fps, 1080p@30/60/120/240fps, HDR, gyro-EIS, OIS).
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4K@30/60fps
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Selfie camera
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Single
Single camera sensor configuration with megapixel count, aperture, and sensor details.
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10 MP, f/2.2, 23mm (wide), 1/3.0", 1.22µm
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Sound
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Loudspeaker
Audio output speaker system (e.g. stereo dual speakers, bottom-firing speaker, Dolby Atmos tuning, Hi-Res audio certification).
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Yes, with stereo speakers
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3.5mm jack
Presence of standard 3.5mm stereo headphone / audio jack for connecting wired headphones or external microphones without an adapter.
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No
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Connectivity
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GPS
Satellite positioning and geolocation navigation systems supported (such as GPS, GLONASS, GALILEO, BDS, QZSS, NavIC) with dual-band precision.
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GPS, GALILEO, GLONASS, BDS, QZSS
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WLAN
Wi-Fi networking standards supported (e.g., Wi-Fi 802.11 a/b/g/n/ac/6/6e/7), dual-band, Wi-Fi Direct, and mobile hotspot functionality.
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Wi-Fi 802.11 a/b/g/n/ac/6e, dual-band, Wi-Fi Direct
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Bluetooth
Short-range wireless technology version (e.g., Bluetooth 5.3, 5.4) with supported audio codecs (A2DP, LE, aptX HD, LDAC, LHDC).
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5.4, A2DP, LE
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NFC
Near Field Communication technology used for wireless contactless payments (Google Pay, Apple Pay), transit cards, and instant pairing.
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Yes
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FM radio
Built-in FM radio receiver for listening to broadcast radio stations over the air (often requiring wired earphones as an antenna).
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No
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USB
Universal Serial Bus connector type and specification (e.g. USB Type-C 2.0 / 3.2 Gen 1), supporting OTG (On-The-Go) data transfer and DisplayPort.
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USB Type-C
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Features
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Sensors
Built-in hardware sensors (such as fingerprint scanner under-display/side-mounted, accelerometer, gyro, proximity sensor, compass, barometer, color spectrum).
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Fingerprint (side-mounted), accelerometer, gyro, proximity, compass, barometerCircle to Search
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Battery
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Capacity
Battery energy storage capacity measured in milliampere-hours (mAh) indicating total power reserve.
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4000 mAh
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Charging
Wired and wireless fast charging wattage and protocols (e.g., 67W Turbo Charge, USB Power Delivery 3.0, Quick Charge, MagSafe wireless, reverse wireless charging).
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25W wired, QC2.0, 50% in 30 min15W wireless4.5W reverse wireless
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More
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Models
Manufacturer model code identifiers (e.g. SM-S928B, A3106, 23117RK66C) representing regional variants.
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SM-F761N
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Made by
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South Korea
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Color
Official color finishes and aesthetic variants released by the manufacturer for this device.
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Black, White
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General Specs
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Display
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6.7″ 1080×2640 pixels
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RAM
Random Access Memory capacity used by the operating system and running apps for multitasking, caching, and fast app switching.
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8 GB
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Price
Official retail launch price or current market pricing across official and unofficial channels.
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₦875,000
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Released
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2025 July
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ROM
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128/256 GB
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Disclaimer
We do not guarantee that the information of this page is 100% accurate and up to date. Read more about our full disclaimer
Samsung Galaxy Z Flip7 FE Price in Malaysia September 2026
| Model | Samsung Galaxy Z Flip7 FE |
| Price | Coming soon |
| Display | 6.7″ 1080×2640 pixels |
| RAM | 8 GB |
| ROM | 128/256 GB |
| Released | 2025, July 25 |
Questions and opinions about the Galaxy Z Flip7 FE
When be it will be released?
It will launch in July 2025.
What is the price of the Samsung Galaxy Z Flip7 FE?
The price of the Samsung Galaxy Z Flip7 FE is ₦875,000.
How much RAM and ROM does it contain?
It has one variant of 8GB in RAM and two variants of 128/256GB in ROM. But, overall you can get three variants (128GB/8GB, 256GB/8GB) in the market.
Which type of display panel is used?
It has a 6.7″ Foldable Dynamic LTPO AMOLED 2X Display panel with 1080 x 2640 pixels resolution.
How are the processor and chipset?
It contains a Exynos 2400 (4 nm).
What are the camera and video capabilities?
The dual-camera setup on the back is 50MP+12MP and a 10MP selfie camera. The video recording capability is 4K@30/60fps, 1080p@60/120/240fps, 720p@960fps, HDR10+.
Does it support a 5G network?
Yes, It supports a 5G network with 2G / 3G / 4G.
What is the battery capacity?
The battery capacity is a 4000mAh Li-Polymer battery with 25W fast charging.
What sensors does this phone have?
Fingerprint, accelerometer, gyro, proximity, compass, barometer.
Which country and company manufactured it?
Samsung manufactured it and this phone is made in South Korea.
